- The seminar will provide participants with an in-depth understanding of the failure mechanisms, test structures, equipment and testing methods used to achieve today's high reliability components.
- The participant will be able to gather data and determine how best to plot the data and make inferences from that data.
- The seminar will identify the major failure mechanisms, explain how they are observed, how they are modeled and how they are eliminated. There will be a particular emphasis on electromogration and package level failure mechanisms.
- The seminar offers a variety of video demonstration of analysis techniques, so that the analyst can get an understanding of the types of results they might expect to see with their equipment.
- The participant will be able to identify basic test structures and how they are used to help quantify reliability on Semiconductor devices.
- The participant will be able to knowledgeably implement screens that are appropriate to assure the reliability of a component.
- The participant will be able to identify appropriate tools to purchase when starting or expanding a laboratory.
- In this course, we will concentrate in particular on electromigration. The customer has identified electromigration as a particular concern and area where they need additional knowledge.
Estimated Course Duration: 16