If you wish to take a course to receive a certificate, you must take the course under "Online Courses". Do NOT take the course here under "Materials By Topic" as you would not receive a certificate for completing the materials here. The "Materials By Topic" content is intended just for reference purposes.

Semiconductor packaging is becoming increasingly challenging. As integrated circuits increase in performance, new packaging techniques are required to remove the heat, handle the increased number of bondpads, and deal with the fragile Lo-K dielectrics used on these circuits. New technologies such as optoelectronics and microelectromechanical systems (MEMS) can require specialized packages. Smaller form factors require engineers to use higher density packaging options, like array packaging, chip scale packaging, and multi-chip modules. Although packaging can be a challenge, it can also provide a lower cost path for integration needs. For example, a system in a package design can be more cost effective than a system on a chip design. This section covers packaging technology issues, packaging design and modeling issues, as well as packaging reliability challenges.