Semiconductor packaging is becoming increasingly challenging. As integrated circuits increase in performance, new packaging techniques are required to remove the heat, handle the increased number of bondpads, and deal with the fragile Lo-K dielectrics
used on these circuits. New technologies such as optoelectronics and microelectromechanical systems (MEMS) can require specialized packages. Smaller form factors require engineers to use higher density packaging options, like array packaging, chip
scale packaging, and multi-chip modules. Although packaging can be a challenge, it can also provide a lower cost path for integration needs. For example, a system in a package design can be more cost effective than a system on a chip design. This
section covers packaging technology issues, packaging design and modeling issues, as well as packaging reliability challenges.
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