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This material covers the electrical behavior, thermal properties, and the structural and mechanical aspects of electronic packaging. As packaging technology increases in complexity, a whole host of electrical, thermal, and mechanical issues must be accounted for and modeled. The electrical issues include resistance, capacitance, cross talk issues, power and ground bus disturbances, and high frequency packaging. Thermal issues include heat dissipation, the uses of ceramic and plastic, actively cooled packages, heat sinks and planes, and materials issues. Mechanical include thermal coefficient of expansion issues, plastic vs. ceramic packaging, as well as soldering issues. This material also covers the modeling techniques used to characterize these issues.