Semiconductor Packaging is increasingly important to the success of almost all electronic systems. Engineers continue to develop and implement packaging approaches and methods that lead to higher performance products, products that take us less physical space, and products that can dissipate increasing amounts of heat. One major area of activity in recent years has been wafer level packaging. Wafer Level Packaging is an 8-hour online course that offers detailed instruction on the technologies used to create Wafer Chip Scale Packages (WCSPs) Fan-Out Wafer Level Packages (FOWLPs), Fan-Out Panel Level Packages (FOPLPs), and the processing technologies required to make them. We place special emphasis on current issues related to manufacturing the current and next generation products. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.