IC Packaging Design and Modeling offers a comprehensive overview of integrated circuit packaging, combining design fundamentals with advanced modeling techniques. The course starts with an introduction to the field and progresses through essential topics such as package technology, design principles, optimal material selection, and effective collaboration with packaging subcontractors. It further explores practical methods for package modeling and concludes with insights into advanced and emerging packaging innovations, supported by curated references and supplemental materials.
Estimated Course Duration: 8