This course provides an overview of the Semiconductor Technology manufacturing process. We divide this course into three sections: processing, packaging and testing. The processing section covers wafer fab processing techniques at a high level. These are the basic tools and techniques used to grow, etch, deposit, and pattern the thin films on a semiconductor or integrated circuit chip. For more detailed information on wafer fab processing techniques, please visit the Processing and Process Integration Classrooms located nearby in this system. The packaging section covers at a high level the basic techniques to package a semiconductor component into a form that can be used in an electronic system. These techniques including wire bonding, die attach, solder ball attach, molding, and so on. We also discuss the packaging design process and the various types of packages. For more detailed information on packaging techniques, please visit the Packaging Design and Packaging Technology Classrooms located nearby in this system. The testing section covers general information on how to test components. It includes an overview of the testing process and materials on various test techniques and design techniques like Scan-Based Testing. For more detailed information on testing techniques, please visit the Test Classroom located nearby in this system.