Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, the proliferation of new package types, etc. This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. While customers expect high reliability levels, incorrect assumptions, testing, calculations, and qualification procedures can severely impact reliability. Your company needs competent engineers and scientists to help solve these problems.